ESR18EZPJ102 footprint, schematic symbol and 3D model by ROHM Semiconductor

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ESR18EZPJ102 Details

The recommended land pattern for ESR18EZPJ102 is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.5mm x 0.5mm. The land pattern should be designed to accommodate the component's dimensions and thermal considerations.
To handle thermal considerations for ESR18EZPJ102, ensure that the PCB design provides adequate thermal relief paths to dissipate heat generated by the component. A thermal via or thermal pad can be used to connect the component to a heat sink or a thermal ground plane.
The recommended soldering temperature profile for ESR18EZPJ102 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
Yes, ESR18EZPJ102 is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and damage.
To ensure the reliability of ESR18EZPJ102 in a humid environment, apply a conformal coating to the PCB to prevent moisture ingress. Additionally, ensure that the component is stored in a dry environment, and the PCB is designed with moisture-resistant materials and a suitable moisture barrier.

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