A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a common mode choke to reduce EMI.
Use a thermal interface material (TIM) with a high thermal conductivity to improve heat transfer between the device and the heat sink. Also, ensure good airflow and avoid hot spots on the PCB.
The maximum allowable voltage drop is 0.5V. Exceeding this value may affect the device's performance and reliability.
Yes, but ensure that the devices are matched in terms of their electrical characteristics and thermal performance. Also, use a common busbar to connect the devices in parallel.
Use a thermal imaging camera to identify hotspots, and check the device's voltage and current ratings. Also, verify the PCB layout and component placement to ensure they meet the recommended guidelines.
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EVQPUA02K Overview
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