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EXB2HV330JV - Panasonic

Description: 33 Ohm ±5% 62.5mW Power Per Element Isolated 8 Resistor Network/Array ±200ppm/°C 1506, Convex, Long Side Terminals

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EXB2HV330JV - Panasonic PCB footprint - Other - Other - EXB2HV330JV-3
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EXB2HV330JV - Panasonic  - 3D model - Other - EXB2HV330JV-3
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EXB2HV330JV Details

  • Manufacturer Part Number:

    EXB2HV330JV

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.063 W

  • First Element Resistance:

    33 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    3.8 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-9

  • Resistance:

    33 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    33 Ω

  • Size Code:

    1506

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    25 V

EXB2HV330JV Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the EXB2HV330JV is between 250°C to 260°C for a maximum of 3 seconds.
  • Yes, the EXB2HV330JV is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • The EXB2HV330JV is designed to operate in high-temperature environments up to 150°C, with a capacitance change of ±15% over the operating temperature range.
  • Yes, the EXB2HV330JV is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the EXB2HV330JV is a rectangular pad with a size of 3.5 mm x 2.5 mm, with a solder mask opening of 3.1 mm x 2.1 mm.

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EXB2HV330JV Overview

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