EYSHSNZWZ footprint, schematic symbol and 3D model by TAIYO YUDEN

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EYSHSNZWZ Details

The recommended land pattern for EYSHSNZWZ is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 0.9mm.
To handle thermal considerations, ensure a thermal relief pattern on the PCB, and consider using a thermal interface material (TIM) to improve heat transfer between the component and the PCB.
The maximum operating temperature for EYSHSNZWZ is 125°C, with a recommended operating temperature range of -40°C to 85°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material between the component and the PCB.
The recommended storage condition for EYSHSNZWZ is in a dry, cool place, away from direct sunlight, with a temperature range of 5°C to 30°C and humidity below 60%.

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Use the download button to access the EYSHSNZWZ schematic symbol, PCB footprint, and 3D model.

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