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F2250NLGK8 - Renesas Electronics

Description: The F2250 is a low insertion loss Voltage Variable RF Attenuator (VVA) covers a broad frequency range from 50 MHz to 6000 MHz.  In addition to providing low insertion loss, the F2250 provides excellent linearity performance over its entire voltage control and attenuation range. The device uses a single positive supply voltage of 3.15 V to 5.25 V.  Other features include the VMODE pin allowing either positive or negative voltage control slope vs attenuation and multi-directional operation meaning the RF inpu

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F2250NLGK8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2_REV01
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F2250NLGK8 Details

  • Manufacturer Part Number:

    F2250NLGK8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Attenuation-Nom:

    35 dB

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    30 dBm

  • Insertion Loss-Max:

    3.1 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    6000 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    3.3/5 V

  • RF/Microwave Device Type:

    VARIABLE ATTENUATOR

  • Supply Current-Max:

    2 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • VSWR-Max:

    1.33

F2250NLGK8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure that the device is operated within the recommended temperature range (–40°C to 125°C) and consider using thermal monitoring and shutdown mechanisms.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling. Place a 10uF ceramic capacitor and a 10uF electrolytic capacitor in parallel as close to the power pins as possible. Add a 1uF ceramic capacitor for high-frequency decoupling. Ensure that the power supply voltage is within the recommended range (1.14V to 1.26V).
  • Use a clock gating technique to reduce clock signal switching activity. Implement a hierarchical clock tree with a single clock source and use clock buffers to minimize clock skew. Consider using a clock domain crossing (CDC) technique to reduce power consumption.
  • Follow the PCB design guidelines for signal integrity, including controlled impedance, matched impedance, and differential signaling. Ensure that the PCB layout meets the EMC requirements, including minimizing loop areas, using shielding, and implementing EMI filters.

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F2250NLGK8 Overview

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