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F921A105MPA - Kyocera AVX

Description: 1 µF Molded Tantalum Capacitors 10 V 0805 (2012 Metric) 12Ohm

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F921A105MPA - Kyocera AVX - PCB symbol
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PCB Footprints
F921A105MPA - Kyocera AVX PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - 0805 (2012 Metric)_2026
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F921A105MPA - Kyocera AVX - 3D model - Capacitor Moulded Polarised - 0805 (2012 Metric)_2026
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F921A105MPA Details

  • Manufacturer Part Number:

    F921A105MPA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Manufacturer:

    Kyocera AVX Components

  • YTEOL:

    7.21

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    1 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    12000 mΩ

  • Height:

    1.1 mm

  • Leakage Current:

    0.0005 mA

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    10 V

  • Ripple Current:

    20 mA

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Tan Delta:

    0.08

  • Terminal Shape:

    J BEND

  • Width:

    1.25 mm

F921A105MPA Frequently Asked Questions (FAQs)

  • The recommended land pattern for F921A105MPA is a rectangular pad with a size of 3.3mm x 1.3mm, with a solder mask clearance of 0.2mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • F921A105MPA is a moisture-sensitive device (MSD) and requires special handling to prevent damage. It should be stored in a dry environment with a relative humidity of 20% or less, and should be baked at 125°C for 24 hours before reflow soldering.
  • The maximum reflow temperature for F921A105MPA is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The reflow profile should be controlled to prevent overheating, which can cause damage to the component.
  • Yes, F921A105MPA is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • To ensure the reliability of F921A105MPA in high-temperature applications, it's recommended to follow the manufacturer's guidelines for temperature derating, and to ensure that the component is properly cooled to prevent overheating. Additionally, the PCB should be designed to minimize thermal stress and ensure good thermal conductivity.

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F921A105MPA Overview

Use the download button to access the F921A105MPA schematic symbol, PCB footprint, and 3D model.
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About Kyocera AVX

Kyocera AVX is a global leader in the design, manufacture, and supply of electronic components, including capacitors, resistors, filters, connectors, and advanced ceramic products. The company was formed as a result of Kyocera Corporation's acquisition of AVX Corporation, combining Kyocera's expertise in ceramic technologies with AVX's strength in passive electronic components. This merger has allowed Kyocera AVX to offer a broad and diversified product portfolio, serving various industries.

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