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FA28NP02E222JNU06 - TDK

Description: MLCC with Dipped Radial Lead, Capacitance=2.2nF, LxWxT:4x5.5x2.5mm, Lead pitch:5mm

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PCB Footprints
FA28NP02E222JNU06 - TDK PCB footprint - Other - Other - FA28
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FA28NP02E222JNU06 - TDK  - 3D model - Other - FA28
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FA28NP02E222JNU06 Details

  • Manufacturer Part Number:

    FA28NP02E222JNU06

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.16

  • Capacitance:

    0.0022 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    5.5 mm

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    5%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Positive Tolerance:

    5%

  • Rated (DC) Voltage (URdc):

    250 V

  • Reference Standard:

    AEC-Q200

  • Surface Mount:

    NO

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Pitch:

    5 mm

  • Terminal Shape:

    WIRE

  • Width:

    2.5 mm

FA28NP02E222JNU06 Frequently Asked Questions (FAQs)

  • The recommended land pattern for FA28NP02E222JNU06 can be found in the TDK Corporation's application note or footprint library. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the FA28NP02E222JNU06 by the edges, avoid touching the terminals, and use an anti-static wrist strap or mat. Also, ensure the assembly area is clean and free from debris. Follow the recommended storage and handling procedures outlined in the datasheet or TDK Corporation's guidelines.
  • The thermal management strategy for FA28NP02E222JNU06 involves ensuring good thermal conductivity between the component and the PCB. This can be achieved by using thermal vias, thermal pads, or heat sinks. The recommended thermal management strategy can be found in the datasheet or TDK Corporation's application notes.
  • The FA28NP02E222JNU06 is designed to withstand certain levels of vibration, but it's essential to evaluate the component's performance in the specific vibration environment. Consult with TDK Corporation or refer to their application notes for guidance on using the component in high-vibration environments.
  • To troubleshoot issues with FA28NP02E222JNU06, follow a systematic approach: check the component's datasheet, application notes, and PCB layout; verify the assembly process; and perform electrical tests to identify the root cause of the issue. Consult with TDK Corporation's technical support or a qualified engineer if needed.

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FA28NP02E222JNU06 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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