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FAN3217TMX - onsemi

Description: 2.4A Sink / 1.6A Source at VOUT = 6V; Typical Propagation Delay Under 20ns Matched within 1ns to the Other Channel; Two Versions of Dual Independent Drivers: ; TTL Input Thresholds; Double Current Capability by Paralleling Channels; Standard SOIC-8 Package; Rated from -40°C to +125°C Ambient; 4.5 to 18V Operating Range; MillerDrive™ Technology; Internal Resistors Turn Driver Off If No Inputs; 3A Peak Sink/Source at VDD = 12V; Dual Non-Inverting (FAN3217); Dual Inverting (FAN3216); 12ns / 9ns Typical Rise/Fa

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FAN3217TMX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD, SOIC, JDEC MS-012, 0.150" NARROW BODY
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FAN3217TMX - onsemi  - 3D model - Small Outline Packages - 8-LEAD, SOIC, JDEC MS-012, 0.150" NARROW BODY
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FAN3217TMX Details

  • Manufacturer Part Number:

    FAN3217TMX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.034 µs

  • Turn-on Time:

    0.034 µs

  • Width:

    3.9 mm

FAN3217TMX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FAN3217TMX should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure the device is properly heatsinked, and the junction temperature (TJ) is kept below the maximum rating of 150°C. Monitor the device's thermal shutdown threshold (TSD) and adjust the system design accordingly.
  • For EMI filtering and noise reduction, use a pi-filter (L-C-L) or a common-mode choke on the input lines. Ensure the filter components are placed close to the device, and the PCB layout is designed to minimize radiation and conducted emissions.
  • To minimize standby power consumption, ensure the enable pin (EN) is properly driven to a logic-low state during shutdown. Additionally, consider using a low-dropout regulator or a low-quiescent-current voltage regulator to supply the device.
  • Monitor the device's output voltage (VOUT), output current (IOUT), and junction temperature (TJ) for fault detection and protection. Implement overvoltage protection (OVP), undervoltage protection (UVP), and overcurrent protection (OCP) to prevent damage from abnormal operating conditions.

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