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FAN3852UC16X - onsemi

Description: Total Harmonic Distortion 0.02%; Input Clock Frequency Range of 1-4MHz; Integrated Low Drop-Out Regulator (LDO); 1.5kV HBM ESD on MIC Input; Optimized for Mobile Handset and Notebook PC Microphone Applications; Accepts Input from Electret Condenser Microphones (ECM); Pulse Density Modulation (PDM) Output; Standard 5-Wire Digital Interface; Low Input Capacitance, High PSR, 20 kHz Pre-Amplifier; Low-Power 1.5µA Sleep Mode; Typical 420µA Supply Current; SNR of 62dB(A) for 16dB Gain

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FAN3852UC16X - onsemi PCB footprint - BGA - BGA - WLCSP6 1.242x0.842x0.457
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FAN3852UC16X - onsemi  - 3D model - BGA - WLCSP6 1.242x0.842x0.457
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FAN3852UC16X Details

  • Manufacturer Part Number:

    FAN3852UC16X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567TS

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.495 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.64 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

FAN3852UC16X Frequently Asked Questions (FAQs)

  • A good PCB layout for the FAN3852UC16X should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable startup and shutdown, ensure that the input voltage (VIN) rises and falls monotonically, and that the enable pin (EN) is properly driven. A soft-start circuit can also be implemented to limit inrush current during startup.
  • When selecting the output capacitor (CO) value, consider the output voltage ripple, output current, and stability requirements. A general rule of thumb is to choose a CO value that is 10-20 times the output capacitance recommended in the datasheet.
  • To minimize EMI, use a shielded inductor, keep the switching node (SW) away from sensitive circuits, and use a common-mode choke or EMI filter on the input and output lines. Additionally, ensure good PCB layout practices, such as separating high-frequency and low-frequency circuits.
  • Operating the FAN3852UC16X at high ambient temperatures can reduce its reliability and lifespan. Ensure that the device is properly heat-sinked, and consider derating the output current and voltage to prevent overheating. Consult the datasheet for thermal derating guidelines.

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FAN3852UC16X Overview

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