Description:4 External Components: 2520 case 0.47 µH Inductor and 0603 Case Size Input and Output Capacitors; Up to 97% Efficient; Input Voltage Range: 2.5 V to 5.5 V; VSEL Control to Optimize Target VOUT; True Load Disconnect; 16-Bump, 1.81mm x 1.81mm, 0.4mm Pitch, WLCSP; Forced Bypass Mode; Integrated Synchronous Rectifier; True Bypass Operatin when VIN > Target VOUT; Maximum Pulse Load Current of 3.5 A for GSM PAs (1 Slot) and PMIC support simultaneously, VIN=3.1 V, VOUT=3.4 V; Fixed Output Voltage Options: 3.0 V to
The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the thermal path short and using a large copper area for heat dissipation is recommended.
To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and provide a stable input voltage within the specified range. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device to minimize parasitic inductance.
Key considerations for EMI and noise reduction include using a shielded layout, keeping the switching node (SW) away from sensitive nodes, using a common-mode choke, and adding EMI filters at the input and output. Additionally, ensuring proper decoupling and bypassing of the device and using a low-ESR output capacitor can help reduce noise and EMI.
To select the right inductor, consider the inductor's saturation current, DC resistance, and core material. The inductor should be able to handle the peak current and have a low DC resistance to minimize losses. The core material should be suitable for the switching frequency and have a high saturation point.
Thermal design considerations include ensuring good airflow around the device, using a heat sink if necessary, and keeping the device away from other heat sources. The device's thermal pad should be connected to a solid ground plane or a heat sink to dissipate heat efficiently.
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FAN48623UC35X Overview
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