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FAN5346S30X - onsemi

Description: Obsolete - 3MHz 600mA DC/DC Buck Converter in WLCSP and MLP package

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PCB Footprints
FAN5346S30X - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-Lead, SuperSOT™-6, JEDEC MO-193, 1.6mm Wide--
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3D Models
FAN5346S30X - onsemi  - 3D model - SOT23 (6-Pin) - 6-Lead, SuperSOT™-6, JEDEC MO-193, 1.6mm Wide--
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FAN5346S30X Details

  • Manufacturer Part Number:

    FAN5346S30X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SSOT-23, 6 PIN

  • Manufacturer Package Code:

    419BL

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

  • fmax-Min:

    0.1 MHz

FAN5346S30X Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature and adjust the design accordingly.
  • The SOA is limited by the maximum current, voltage, and power dissipation. Refer to the datasheet for specific limits and ensure the design operates within these boundaries.
  • Yes, the FAN5346S30X is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Use a systematic approach to troubleshoot: check the power supply, input/output connections, and thermal design. Consult the datasheet and application notes for guidance.

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FAN5346S30X Overview

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