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FAN5362UC29X - onsemi

Description: Obsolete - 3MHz, 500mA / 750mA Synchronous Buck Regulator

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PCB Footprints
FAN5362UC29X - onsemi PCB footprint - BGA - BGA - WLCSP6 1.31x0.96x0.586 CASE 567RS ISSUE O
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3D Models
FAN5362UC29X - onsemi  - 3D model - BGA - WLCSP6 1.31x0.96x0.586 CASE 567RS ISSUE O
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FAN5362UC29X Details

  • Manufacturer Part Number:

    FAN5362UC29X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567RS

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO CONFIGURE IN PULSE FREQUENCY MODULATION

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.31 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    3.045 V

  • Output Voltage-Min:

    2.755 V

  • Output Voltage-Nom:

    2.9 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.96 mm

FAN5362UC29X Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thick copper traces for power and ground, and minimizing the distance between the device and the thermal pad or heat sink. Additionally, using a 4-layer PCB with a solid ground plane can help to reduce thermal resistance.
  • To ensure stable output voltage regulation, it's essential to follow the recommended component values and layout guidelines in the datasheet. Additionally, make sure to decouple the input and output pins with suitable capacitors, and use a low-ESR output capacitor to minimize output voltage ripple.
  • Although the datasheet specifies a maximum input voltage of 29V, it's recommended to derate the input voltage to 25V or lower to ensure reliable operation and to prevent damage to the device.
  • To calculate the power dissipation of the device, use the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. Make sure to consider the thermal resistance of the package and the PCB layout when calculating the power dissipation.
  • The recommended input capacitor value is 1uF to 10uF, and it's recommended to use a low-ESR ceramic capacitor, such as an X5R or X7R type, to minimize input voltage ripple and ensure stable operation.

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FAN5362UC29X Overview

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