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FAN5702UC15X - onsemi

Description: ON SEMICONDUCTOR - FAN5702UC15X - LED DRIVER WITH I2C INTERFACE

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PCB Footprints
FAN5702UC15X - onsemi PCB footprint - BGA - BGA - WLCSP-16,0.4mm
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FAN5702UC15X - onsemi  - 3D model - BGA - WLCSP-16,0.4mm
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FAN5702UC15X Details

  • Manufacturer Part Number:

    FAN5702UC15X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WLCSP-16

  • Manufacturer Package Code:

    567SB

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    1.61 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.61 mm

  • fmax-Min:

    0.4 MHz

FAN5702UC15X Frequently Asked Questions (FAQs)

  • A good PCB layout for the FAN5702UC15X should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure a low-thermal-resistance path to the PCB's ground plane. Use multiple vias to connect the thermal pad to the ground plane, and keep the thermal pad as large as possible.
  • The input capacitor value depends on the input voltage ripple, output voltage, and switching frequency. A general guideline is to use a capacitor with a value between 10uF to 22uF, with a voltage rating of at least 1.5 times the input voltage. Consult the datasheet and application notes for more specific guidance.
  • The maximum output current of the FAN5702UC15X is 2A, but this is dependent on the input voltage, output voltage, and thermal conditions. Be sure to check the datasheet's thermal derating curves and output current vs. input voltage graphs to ensure safe operation.
  • To ensure stability, follow the datasheet's guidelines for output capacitor selection, and use a capacitor with a low equivalent series resistance (ESR). Additionally, ensure the input voltage is within the recommended range, and the device is properly decoupled with ceramic capacitors.
  • The EN pin is used to enable or disable the device. When EN is high, the device is enabled, and when EN is low, the device is disabled. Use the EN pin to implement power sequencing, or to turn the device on and off as needed. Be sure to follow the datasheet's guidelines for EN pin voltage and timing.

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FAN5702UC15X Overview

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