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FAN7083MX_GF085 - onsemi

Description: FAN7083MX_GF085

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FAN7083MX_GF085 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE751EB
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FAN7083MX_GF085 Details

  • Manufacturer Part Number:

    FAN7083MX_GF085

  • Brand Name:

    ON Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP8,.25

  • Manufacturer Package Code:

    M08A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    6 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.25 µs

  • Turn-on Time:

    0.25 µs

  • Width:

    3.9 mm

FAN7083MX_GF085 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-3 layer PCB with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a heat sink or thermal pad, and follow proper PCB design and layout guidelines.
  • Critical components to consider when designing a power supply using the FAN7083MX-GF085 include the input capacitor, output capacitor, inductor, and diode. Proper selection and design of these components are crucial for efficient and reliable operation.
  • To troubleshoot issues with the FAN7083MX-GF085, check for proper PCB layout, ensure that the device is operated within the recommended temperature range, verify that the input and output capacitors are properly selected, and check for any signs of physical damage or wear.
  • Key considerations for EMI and EMC compliance when using the FAN7083MX-GF085 include proper PCB layout, shielding, and filtering, as well as ensuring that the device is operated within the recommended frequency range and that the input and output are properly decoupled.

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FAN7083MX_GF085 Overview

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Part Image FAN7083MX-GF085 onsemi

Half Bridge Based MOSFET Driver, 0.4A, PDSO8