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FC3BACALI16.0 - Fox

Description: Crystals 16MHz 18pF 30ppm -40C +125C

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PCB Footprints
FC3BACALI16.0 - Fox PCB footprint - Other - Other - FC3BACALI16.0-3
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3D Models
FC3BACALI16.0 - Fox  - 3D model - Other - FC3BACALI16.0-3
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FC3BACALI16.0 Details

  • Manufacturer Part Number:

    FC3BACALI16.0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • Manufacturer:

    Fox Electronics

  • Additional Feature:

    AEC-Q200; IATF-16949QMS

  • Aging:

    5 PPM/YEAR

  • Crystal/Resonator Type:

    PARALLEL - FUNDAMENTAL

  • Drive Level:

    100 µW

  • Frequency Stability:

    0.01%

  • Frequency Tolerance:

    30 ppm

  • JESD-609 Code:

    e4

  • Load Capacitance:

    18 pF

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Frequency-Nom:

    16 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Physical Dimension:

    3.2mm x 2.5mm x 0.7mm

  • Series Resistance:

    60 Ω

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

FC3BACALI16.0 Frequently Asked Questions (FAQs)

  • Fox Electronics recommends a 4-layer PCB with a solid ground plane, and a separate power plane for the oscillator. Keep the crystal oscillator traces as short as possible and away from noisy signals.
  • Make sure the oscillator circuit is properly biased, and the crystal is correctly oriented. Also, ensure the power supply is stable and within the recommended voltage range. A 10nF to 22nF capacitor between the XTAL pins can help improve startup reliability.
  • The FC3BACALI16.0 can tolerate a frequency deviation of up to ±50 ppm for the crystal oscillator. However, it's recommended to use a crystal with a deviation of ±20 ppm or less for optimal performance.
  • Yes, but it's not recommended. The FC3BACALI16.0 is optimized for 16.384 MHz, and using a different frequency may affect its performance and accuracy. If you must use a different frequency, consult with Fox Electronics or perform thorough testing to ensure compatibility.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output pins to protect the device from electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD risks.

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FC3BACALI16.0 Overview

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