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FCH47N60F-F133 - onsemi

Description: Power MOSFET, N-Channel, SUPERFET®, FRFET®, 600 V, 47 A, 73 mΩ, TO-247,−55 to + 150 °C

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FCH47N60F-F133 - onsemi PCB footprint - Other - Other - TO−247−3LD SHORT LEAD CASE 340CK ISSUE A_2025
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FCH47N60F-F133 - onsemi  - 3D model - Other - TO−247−3LD SHORT LEAD CASE 340CK ISSUE A_2025
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FCH47N60F-F133 Details

  • Manufacturer Part Number:

    FCH47N60F-F133

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247 3L

  • Manufacturer Package Code:

    340CK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2017-11-02

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    1800 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    47 A

  • Drain-source On Resistance-Max:

    0.073 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    417 W

  • Pulsed Drain Current-Max (IDM):

    141 A

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    1260 ns

  • Turn-on Time-Max (ton):

    880 ns

FCH47N60F-F133 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FCH47N60F-F133 is a TO-220AB package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation of FCH47N60F-F133 in high-temperature environments, it is recommended to use a heat sink with a thermal resistance of less than 1°C/W and to maintain a maximum junction temperature of 150°C.
  • The maximum allowed voltage transient for FCH47N60F-F133 is 650V, and it is recommended to use a voltage clamp or snubber circuit to protect the device from voltage spikes.
  • To prevent parasitic turn-on of FCH47N60F-F133 due to Miller capacitance, it is recommended to use a gate resistor of at least 1kΩ and to minimize the length of the gate trace to reduce the effect of Miller capacitance.
  • The recommended gate drive voltage for FCH47N60F-F133 is between 10V and 15V, with a maximum gate-source voltage of 20V.

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FCH47N60F-F133 Overview

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