Part Image

FDB0165N807L - onsemi

Description: Fast Switching Speed ; High Performance Trench Technology for Extremely Low rDS(on) ; Low Gate Charge ; Max rDS(on) = 1.6 mΩ at VGS = 10 V, ID = 36 A ; High Power and Current Handling Capability ; RoHS Compliant

Download FDB0165N807L Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FDB0165N807L - onsemi PCB footprint - Other - Other - FDB0165N807L-2
click to zoom
3D Models
FDB0165N807L - onsemi  - 3D model - Other - FDB0165N807L-2
click to zoom

FDB0165N807L Details

  • Manufacturer Part Number:

    FDB0165N807L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-7 / TO-263-7

  • Package Description:

    D2PAK-7/6

  • Manufacturer Package Code:

    418AY

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    1083 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    310 A

  • Drain-source On Resistance-Max:

    0.0016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1050 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    1780 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    299 ns

  • Turn-on Time-Max (ton):

    275 ns

FDB0165N807L Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDB0165N807L is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and handling procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a robust PCB design, and implementing adequate thermal management and ESD protection.
  • A recommended PCB layout for the FDB0165N807L includes a thermal pad connected to a large copper area for heat dissipation. A thermal management strategy should include a heat sink or thermal interface material to reduce thermal resistance.
  • Handle the FDB0165N807L by the body, avoiding touching the leads or die. Store the devices in an anti-static bag or wrap, and avoid exposing them to moisture or extreme temperatures.
  • The recommended soldering conditions for the FDB0165N807L include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering iron temperature of 350°C.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FDB0165N807L Overview

Use the download button to access the FDB0165N807L schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDB01, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FDB0165N807L

Showing 0 results