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FDB0260N1007L - onsemi

Description: High Performance Trench Technology for Extremely Low RDS(on) ; Max rDS(on) = 2.6 mΩ at VGS = 10 V, ID = 27 A ; Low Gate Charge ; RoHS Compliant ; High Power and Current Handling Capability ; Fast Switching Speed

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FDB0260N1007L - onsemi PCB footprint - Other - Other - FDB0260N1007L-2
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FDB0260N1007L Details

  • Manufacturer Part Number:

    FDB0260N1007L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-7 / TO-263-7

  • Package Description:

    D2PAK-7/6

  • Manufacturer Package Code:

    418AY

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    912 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    200 A

  • Drain-source On Resistance-Max:

    0.0026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    65 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    250 W

  • Pulsed Drain Current-Max (IDM):

    1100 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    115 ns

  • Turn-on Time-Max (ton):

    94 ns

FDB0260N1007L Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FDB0260N1007L is a 2.5mm x 2.5mm pad with a 1.5mm x 1.5mm thermal pad in the center, and a 0.5mm keep-out zone around the device.
  • To ensure reliable operation of FDB0260N1007L in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management.
  • The maximum allowed voltage on the gate of FDB0260N1007L is 20V, and it is recommended to keep the gate voltage between 0V and 15V for reliable operation.
  • To protect FDB0260N1007L from electrostatic discharge (ESD), it is recommended to follow proper ESD handling and storage procedures, including using ESD-safe packaging and handling tools.
  • The recommended drive circuit for FDB0260N1007L is a non-inverting driver with a resistive load, and a gate resistor value between 10Ω and 100Ω to ensure reliable switching.

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