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FDB0300N1007L - onsemi

Description: Max rDS(on) = 3 mΩ at VGS = 10 V, ID = 26 A ; Max rDS(on) = 4.5 mΩ at VGS = 6 V, ID = 20 A ; Low Gate Charge ; High Performance Trench Technology for Extremely Low RDS(on) ; RoHS Compliant ; High Power and Current Handling Capability ; Fast Switching Speed

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PCB Footprints
FDB0300N1007L - onsemi PCB footprint - Other - Other - D2-PAK(TO263)
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3D Models
FDB0300N1007L - onsemi  - 3D model - Other - D2-PAK(TO263)
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FDB0300N1007L Details

  • Manufacturer Part Number:

    FDB0300N1007L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK-7 / TO-263-7

  • Package Description:

    D2PAK-7/6

  • Manufacturer Package Code:

    418AY

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    843 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    200 A

  • Drain-source On Resistance-Max:

    0.003 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    250 W

  • Pulsed Drain Current-Max (IDM):

    1090 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    115 ns

  • Turn-on Time-Max (ton):

    91 ns

FDB0300N1007L Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDB0300N1007L is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a robust PCB design, and implementing adequate ESD protection and surge protection.
  • A recommended PCB layout for the FDB0300N1007L includes a thermal pad connected to a large copper area for heat dissipation. Ensure a low thermal resistance path to the heat sink or ambient air. A thermal interface material (TIM) can be used to improve heat transfer.
  • When designing and testing with the FDB0300N1007L, ensure proper safety precautions are taken to avoid electrical shock and damage. Use appropriate test equipment and follow safety guidelines for high-voltage and high-current testing.
  • To mitigate EMI and RFI, use proper shielding, grounding, and filtering techniques. Ensure the PCB layout is designed to minimize radiation and susceptibility. Follow onsemi's application notes and guidelines for EMI and RFI mitigation.

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FDB0300N1007L Overview

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