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FDB035N10A - onsemi

Description: High Power and Current Handling Capability; RoHS Compliant; Low Gate Charge, QG = 89nC ( Typ.); RDS(on) = 3.0mΩ ( Typ.)@ VGS = 10V, ID = 75A; Fast Switching Speed; High Performance Trench Technology for Extremely Low RDS(on)

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PCB Footprints
FDB035N10A - onsemi PCB footprint - Other - Other - FDB035N10A-1
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3D Models
FDB035N10A - onsemi  - 3D model - Other - FDB035N10A-1
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FDB035N10A Details

  • Manufacturer Part Number:

    FDB035N10A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    D2PAK-3/2

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    558 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    210 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    333 W

  • Pulsed Drain Current-Max (IDM):

    704 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDB035N10A Frequently Asked Questions (FAQs)

  • The FDB035N10A is a power MOSFET, and as such, it does not have a specific maximum operating frequency. However, it is designed for high-frequency switching applications, and its performance is optimized for frequencies up to 1 MHz.
  • To ensure proper thermal management, it is essential to provide a good thermal path from the device to a heat sink or other cooling mechanism. This can be achieved by using a thermal interface material, such as thermal paste or thermal tape, and ensuring that the heat sink is properly attached to the device.
  • The recommended gate drive voltage for the FDB035N10A is between 4.5V and 10V. However, the optimal gate drive voltage may vary depending on the specific application and operating conditions.
  • To protect the FDB035N10A from overvoltage and overcurrent, it is recommended to use a voltage regulator or a voltage clamp to limit the voltage across the device. Additionally, a current sense resistor and a fuse or circuit breaker can be used to detect and respond to overcurrent conditions.
  • The maximum junction temperature of the FDB035N10A is 150°C. It is essential to ensure that the device does not exceed this temperature to prevent damage or degradation.

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FDB035N10A Overview

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