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FDB86135 - onsemi

Description: Max RDS(on) = 3.5mΩ at VGS = 10V, ID = 75A ; Low Gate Charge ; RoHS Compliant ; Fast Switching Speed ; High Power and Current Handling Capability ; High Performance Trench Technology for Extremely Low RDS(on)

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FDB86135 Details

  • Manufacturer Part Number:

    FDB86135

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    TO-263, D2PAK-3

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Additional Feature:

    ULTRA LOW-ON RESISTANCE

  • Avalanche Energy Rating (Eas):

    658 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    227 W

  • Pulsed Drain Current-Max (IDM):

    704 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDB86135 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 18V). Use a stable voltage regulator and decoupling capacitors (e.g., 10uF and 100nF) to minimize noise and ripple.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, with a voltage rating of 25V or higher. This ensures stable input voltage and reduces noise.
  • Use a TVS diode (e.g., SMAJ18A) for overvoltage protection and a fuse or PTC resettable fuse for overcurrent protection. Ensure the fuse rating is below the device's maximum current rating.
  • The recommended operating temperature range is -40°C to 125°C. However, the device can operate up to 150°C with reduced performance and lifespan.

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FDB86135 Overview

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