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FDBL0630N150 - onsemi

Description: RoHS Compliant ; Typ rDS(on) = 5mΩ at VGS = 10V, ID = 80A ; UIS Capability ; Typ Qg(tot) = 70nC at VGS = 10V, ID = 80

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PCB Footprints
FDBL0630N150 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE B
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3D Models
FDBL0630N150 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE B
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FDBL0630N150 Details

  • Manufacturer Part Number:

    FDBL0630N150

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.2

  • Avalanche Energy Rating (Eas):

    502 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    169 A

  • Drain-source On Resistance-Max:

    0.0063 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    16 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    130 ns

  • Turn-on Time-Max (ton):

    80 ns

FDBL0630N150 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDBL0630N150 is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a thermal interface material to improve heat dissipation.
  • The recommended PCB layout and thermal design for the FDBL0630N150 involves using a thermal pad, thermal vias, and a heat sink to dissipate heat efficiently. Consult the onsemi application note for detailed guidelines.
  • Yes, the FDBL0630N150 is designed for high-power applications. However, ensure that the device is properly cooled and the maximum power rating is not exceeded.
  • To troubleshoot issues, check the device's operating conditions, PCB layout, and thermal design. Consult the onsemi datasheet and application notes for troubleshooting guidelines.

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FDBL0630N150 Overview

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