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FDBL86066-F085 - onsemi

Description: Low RDS(on); Low QG and Capacitance; RoHS Compliant ; AEC Q101 Qualified and PPAP Capable

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PCB Footprints
FDBL86066-F085 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL86066-F085 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL86066-F085 Details

  • Manufacturer Part Number:

    FDBL86066-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    93.6 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    185 A

  • Drain-source On Resistance-Max:

    0.0041 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    26 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    300 W

  • Power Dissipation-Max (Abs):

    300 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    68 ns

  • Turn-on Time-Max (ton):

    35 ns

FDBL86066-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB layout, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Use a shielded enclosure, ensure proper PCB layout, and follow good EMI design practices. Implement a common-mode choke and EMI filters as needed. Also, consider using a metal shield or can around the device.
  • Implement a power-saving mode, reduce the switching frequency, and optimize the gate drive voltage. Also, consider using a low-power mode or shutdown feature if available.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure proper probe placement and use a high-bandwidth oscilloscope with a suitable probe. Follow the recommended test procedures outlined in the datasheet.

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FDBL86066-F085 Overview

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