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FDBL86361-F085 - onsemi

Description: Typical RDS(on) = 1.1 mΩ at VGS = 10V, ID = 80 A; Typical Qg(tot) = 172 nC at VGS = 10V, ID = 80 A; UIS Capability; RoHS Compliant; Qualified to AEC Q101

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FDBL86361-F085 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL86361-F085 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL86361-F085 Details

  • Manufacturer Part Number:

    FDBL86361-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Package Description:

    H-PSOF8L, 8 PIN

  • Manufacturer Package Code:

    100CU

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    820 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.0014 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    139 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    429 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    193 ns

  • Turn-on Time-Max (ton):

    128 ns

FDBL86361-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VCC) to operate correctly. Ensure VIN is within the recommended range (4.5V to 18V) and VCC is set to 5V or 3.3V depending on the application.
  • The FDBL86361-F085 can handle a maximum current of 3A per channel, but this may vary depending on the application and thermal conditions. It's essential to ensure proper thermal management and follow the recommended PCB layout guidelines.
  • Check the input voltage, bias voltage, and output current to ensure they are within the recommended ranges. Verify the PCB layout and thermal management are correct. If issues persist, consult the onsemi support team or a qualified engineer for assistance.
  • Yes, the FDBL86361-F085 is sensitive to electromagnetic interference (EMI). Ensure proper PCB layout, use of shielding, and filtering to minimize EMI effects. Follow the recommended layout guidelines and consult the onsemi application notes for EMI/EMC considerations.

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FDBL86361-F085 Overview

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