Part Image

FDBL86561-F085 - onsemi

Description: Typical RDS(on) = 0.85 mΩ at VGS = 10V, ID = 80 A; Typical Qg(tot) = 170 nC at VGS = 10V, ID = 80 A; UIS Capability; RoHS Compliant; Qualified to AEC Q101

Download FDBL86561-F085 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FDBL86561-F085 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
click to zoom
3D Models
FDBL86561-F085 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
click to zoom

FDBL86561-F085 Details

  • Manufacturer Part Number:

    FDBL86561-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    1167 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.0022 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDBL86561-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to ensure good heat dissipation.
  • Monitor the device's junction temperature, voltage, and current to ensure they are within the specified limits. Use thermal management techniques and follow the recommended PCB layout to minimize thermal resistance.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor value and type may vary depending on the specific application and input voltage ripple requirements.
  • Check the input voltage, output voltage, and current. Verify the PCB layout and component placement. Use an oscilloscope to check for voltage spikes, ringing, or oscillations. Consult the datasheet and application notes for troubleshooting guidelines.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor value and type may vary depending on the specific application and output voltage ripple requirements.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FDBL86561-F085 Overview

Use the download button to access the FDBL86561-F085 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDBL8, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FDBL86561-F085

Showing 0 results