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FDBL86566_F085 - onsemi

Description: N-Channel PowerTrench® MOSFET

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PCB Footprints
FDBL86566_F085 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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3D Models
FDBL86566_F085 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL86566_F085 Details

  • Manufacturer Part Number:

    FDBL86566_F085

  • Brand Name:

    ON Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMALL OUTLINE, R-PSSO-F2

  • Manufacturer Package Code:

    PSOF08A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    193 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    240 A

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    68 ns

  • Turn-on Time-Max (ton):

    86 ns

FDBL86566_F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB layout, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Consult the application note and reference design provided by onsemi. Optimize the PCB layout, component selection, and thermal management system for your specific use case.
  • Follow the recommended soldering temperature profile and assembly guidelines provided in the datasheet. Ensure proper handling and storage of the device to prevent damage.

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FDBL86566_F085 Overview

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