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FDC3512 - onsemi

Description: 3.0 A, 80 V ; High performance trench technology for extremely low RDS(ON) ; Fast switching speed ; RDS(on) = 77 mΩ@ VGS = 10 V ; High power and current handling capability ; RDS(on) = 88 mΩ @ VGS = 6 V ; Low gate charge (13nC typical)

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FDC3512 - onsemi - PCB symbol
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PCB Footprints
FDC3512 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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3D Models
FDC3512 - onsemi - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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FDC3512 Details

  • Manufacturer Part Number:

    FDC3512

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.077 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC3512 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC3512 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded cable for the USB interface can help reduce EMI.
  • The FDC3512 requires a single 3.3V power supply. It's essential to ensure that the power supply is stable and well-regulated. The power sequencing requirement is to power up the 3.3V supply before the USB interface is activated.
  • The FDC3512 supports USB 2.0 high-speed operation up to 3 meters (10 feet) of cable length. However, the actual cable length may vary depending on the specific application and cable quality.
  • To implement the FDC3512 in a USB OTG application, you need to connect the ID pin to a GPIO pin on the microcontroller. The microcontroller can then control the ID pin to switch between host and device modes.
  • The FDC3512 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink or thermal pad, especially in high-temperature environments.

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FDC3512 Overview

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