Part Image

FDC37C669-MS - Microchip

Description: I/O Controller Interface IC Super I/O Controller- Pb Free 100-QFP (14x20)

Download FDC37C669-MS Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FDC37C669-MS - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 100 PIN QFP
click to zoom
3D Models
FDC37C669-MS - Microchip  - 3D model - Quad Flat Packages - 100 PIN QFP
click to zoom
  • Datasheet
  • Stock & Prices $ Price & Stock for FDC37C669-MS
  • Part Number FDC37C669-MS
  • Manufacturer Microchip
  • Pin Count 100
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 100 PIN QFP
  • Released Date Apr 8, 2023
  • Last Modified Date Apr 9, 2023 6:25 AM UTC
  • Pinout / Pin List Click Here (Member Only)

FDC37C669-MS Details

  • Manufacturer Part Number:

    FDC37C669-MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, QFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    QFP-100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Data Transfer Rate-Max:

    0.25 MBps

  • Drive Interface Standard:

    IDE

  • External Data Bus Width:

    8

  • Host Interface Standard:

    PC-AT; PC-XT; PS/2; ISA

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP100,.7X.9

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.15 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE

FDC37C669-MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC37C669-MS involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded cable for the USB connection and keeping the USB traces away from the analog signals can help minimize EMI.
  • To ensure reliable communication, make sure to use a reliable USB cable, configure the host controller correctly, and implement proper error handling and retry mechanisms in the firmware. Additionally, ensure that the FDC37C669-MS is properly configured and initialized before attempting communication.
  • The FDC37C669-MS has a maximum junction temperature of 150°C. To ensure reliable operation in high-temperature environments, ensure good airflow around the device, use a heat sink if necessary, and avoid overheating the device. Additionally, consider using thermal management techniques such as thermal interface materials and heat sinks to reduce the junction temperature.
  • To troubleshoot issues with the FDC37C669-MS, start by checking the power supply and clock signals, then verify that the device is properly configured and initialized. Use a logic analyzer or oscilloscope to debug the USB signals, and check the device's registers and status bits for errors. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • When using the FDC37C669-MS in a battery-powered device, consider using a low-power mode, reducing the clock frequency, and minimizing the number of active circuits. Additionally, use power-saving features such as USB suspend and resume, and consider using a low-power oscillator or clock source. Consult the datasheet and application notes for power-saving techniques and guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FDC37C669-MS Overview

Use the download button to access the FDC37C669-MS schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDC37, or try a keyword search, such as Secondary Storage Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

Parts related to FDC37C669-MS

Showing 0 results

FDC37C669-MS Alternates

Showing results

Image Part Number Model
Part Image FDC37C669-MS SMSC

Floppy Disk Drive, 0.25MBps, IDE Compatible, CMOS, PQFP100