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FDC602P - onsemi

Description: High performance trench technology for extremelylow RDS(ON) ; RDS(on) = 50 mΩ @ VGS = - 2.5V ; Fast switching speed ; RDS(on) = 35 mΩ @ VGS = - 4.5V ; -5.5 A, -20 V

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PCB Footprints
FDC602P - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lea
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3D Models
FDC602P - onsemi  - 3D model - SOT23 (6-Pin) - TSOT23 6−Lea
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FDC602P Details

  • Manufacturer Part Number:

    FDC602P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.5 A

  • Drain-source On Resistance-Max:

    0.033 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC602P Frequently Asked Questions (FAQs)

  • The FDC602P can operate from -40°C to 125°C, making it suitable for a wide range of applications.
  • The FDC602P requires a bias voltage of 5V ± 10% and a bias current of 1mA to 10mA for optimal performance. Ensure the bias voltage is stable and within the recommended range.
  • Use a multi-layer PCB with a solid ground plane and a thermal pad connected to a heat sink or a thermal via to ensure efficient heat dissipation. Keep the PCB layout compact and symmetrical to minimize parasitic inductance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the FDC602P from electrostatic discharge. Ensure the ESD protection devices are rated for the maximum voltage and current of the application.
  • The FDC602P can be driven with a signal source impedance of 50Ω to 100Ω. Use a drive strength of 1mA to 10mA to ensure reliable switching and minimize power consumption.

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FDC602P Overview

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For a full list of alternate parts for FDC602P, check out Findchips.com