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FDD1600N10ALZ - onsemi

Description: RDS(on) = 124mΩ ( Typ.)@ VGS = 10V, ID = 3.5A; RDS(on) = 175mΩ ( Typ.)@ VGS = 5.0V, ID = 2.1A; 100% Avalanche Tested; Low Gate Charge ( Typ.2.78nC); Fast Switching; Low Crss ( Typ. 2.04pF); Improved dv/dt Capability; RoHS Compliant

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FDD1600N10ALZ - onsemi PCB footprint - Other - Other - FDD1600N10ALZ-1
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FDD1600N10ALZ Details

  • Manufacturer Part Number:

    FDD1600N10ALZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    5.08 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    6.8 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    2.04 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    14.9 W

  • Pulsed Drain Current-Max (IDM):

    13.6 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    50 ns

  • Turn-on Time-Max (ton):

    38 ns

FDD1600N10ALZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDD1600N10ALZ is -55°C to 150°C.
  • To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure that the device is operated within the recommended voltage and current ranges.
  • A good PCB layout should prioritize thermal management, with a solid copper plane for heat dissipation. Use thermal vias and a heat sink if possible. Follow the recommended land pattern and keep the device away from heat sources.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper handling and storage procedures to prevent ESD damage.
  • The FDD1600N10ALZ meets or exceeds the quality and reliability standards outlined in the datasheet, including AEC-Q101 and other industry standards.

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FDD1600N10ALZ Overview

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