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FDD1600N10ALZD - onsemi

Description: Last Shipments - N-Channel UltraFET Trench MOSFET, 75V, 50A, 13mΩ

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FDD1600N10ALZD - onsemi PCB footprint - Other - Other - TO252 (D-PAK)_2023-1
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FDD1600N10ALZD Details

  • Manufacturer Part Number:

    FDD1600N10ALZD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-5

  • Package Description:

    DPAK-5/4

  • Manufacturer Package Code:

    369AL

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    5.08 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    6.8 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AD

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    14.9 W

  • Pulsed Drain Current-Max (IDM):

    13.6 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD1600N10ALZD Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the device, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a minimum of 2oz copper thickness and to avoid any thermal vias under the device.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also important to ensure good airflow and to avoid any thermal hotspots on the PCB.
  • The FDD1600N10ALZD has an integrated ESD protection diode, but it's still recommended to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the PCB design to provide additional protection.
  • Yes, the FDD1600N10ALZD is suitable for use in high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions and to ensure that the device is properly qualified and validated for the specific application. Additionally, consider using a device with a higher temperature rating, such as the FDD1600N10ALZDT, which is specifically designed for automotive applications.
  • The optimal gate drive voltage for the FDD1600N10ALZD depends on the specific application and operating conditions. As a general guideline, a gate drive voltage of 10-15V is recommended. However, it's essential to consult the datasheet and to perform thorough testing and validation to determine the optimal gate drive voltage for the specific application.

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FDD1600N10ALZD Overview

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