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FDD86369 - onsemi

Description: UIS capability; Typical rDS(ON) = 5.9mΩ at VGS = 10V, ID = 80A; RoHS Compliant; Typical Qg(tot) = 34 nC at VGS = 10V, ID = 80A

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FDD86369 - onsemi PCB footprint - Other - Other - FDD86369-3
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FDD86369 Details

  • Manufacturer Part Number:

    FDD86369

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2017-01-27

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    29 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.0079 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    150 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    46 ns

  • Turn-on Time-Max (ton):

    70 ns

FDD86369 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDD86369 involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To optimize the FDD86369 for low standby power consumption, ensure that the EN pin is properly biased, use a low-ESR output capacitor, and minimize the output voltage ripple. Additionally, consider using a low-quiescent-current LDO regulator for the VCC pin.
  • The maximum allowed voltage on the VIN pin is 25V, but it's recommended to keep it below 20V to ensure reliable operation and to prevent damage to the device.
  • To troubleshoot the FDD86369, check the input voltage, ensure the EN pin is properly biased, and verify that the output voltage is within the specified range. Also, check for any signs of overheating, and ensure that the device is properly soldered and connected.
  • The FDD86369 is rated for operation up to 150°C, but it's recommended to derate the device's performance at high temperatures. Ensure proper thermal design and consider using a heat sink if the device will be operating in a high-temperature environment.

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FDD86369 Overview

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