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FDD8876 - onsemi

Description: RDS(ON) = 8.2 mΩ @ VGS = 10V @ ID = 35A; RDS(ON) = 10 mΩ @ VGS = 4.5V @ ID = 35A; High performance trench technology for extremely low rDS(ON); Low gate charge; High power and current handling capability

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PCB Footprints
FDD8876 - onsemi PCB footprint - Other - Other - FDD8876-1
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FDD8876 Details

  • Manufacturer Part Number:

    FDD8876

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    95 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    70 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    122 ns

  • Turn-on Time-Max (ton):

    149 ns

FDD8876 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDD8876 involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive nodes.
  • To optimize the FDD8876 for low standby power consumption, ensure that the EN pin is properly biased to turn off the device when not in use. Also, minimize the voltage on the VIN pin and use a low-quiescent-current regulator for the VCC pin. Furthermore, consider using a low-power mode or shutdown mode if available.
  • The maximum allowed voltage on the VIN pin of the FDD8876 is 25V, but it's recommended to keep it below 20V for reliable operation and to prevent damage to the device.
  • To troubleshoot the FDD8876 if it's not switching properly, check the input voltage, the EN pin bias, and the output voltage. Verify that the inductor is properly connected and that the PCB layout is correct. Also, check for any signs of overheating or damage to the device.
  • The FDD8876 is rated for operation up to 150°C, but it's recommended to derate the device's performance at high temperatures. Ensure proper thermal management, such as using a heat sink or a thermal interface material, to prevent overheating and ensure reliable operation.

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FDD8876 Overview

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