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FDH300A - onsemi

Description: ON Semi Diode, 2-Pin DO-204AH FDH300A

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PCB Footprints
FDH300A - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - FDH300A
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3D Models
FDH300A - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - FDH300A
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FDH300A Details

  • Manufacturer Part Number:

    FDH300A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead

  • Package Description:

    DO-35, 2 PIN

  • Manufacturer Package Code:

    017AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.78

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    150 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.68 V

  • JEDEC-95 Code:

    DO-35

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    125 V

  • Reverse Current-Max:

    0.001 µA

  • Reverse Test Voltage:

    125 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

FDH300A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures.
  • The device can withstand voltage stress up to 1.5 times the maximum rated voltage for a short duration (less than 1 second). However, it's recommended to operate within the specified voltage range for reliable operation.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • Store the device in a dry, cool place (less than 30°C and 60% relative humidity) in its original packaging or an anti-static bag to prevent damage from moisture and electrostatic discharge.

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FDH300A Overview

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Part Image FDH300A.TR Fairchild Semiconductor Corporation

DIODE 0.2 A, SILICON, SIGNAL DIODE, DO-35, Signal Diode