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FDH333TR - onsemi

Description: High Conductance Low Leakage Diode

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Symbol
FDH333TR - onsemi - PCB symbol
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PCB Footprints
FDH333TR - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD CASE 017AG ISSUE O-1
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3D Models
FDH333TR - onsemi - 3D model - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD CASE 017AG ISSUE O-1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for FDH333TR
  • Part Number FDH333TR
  • Manufacturer onsemi
  • Pin Count 2
  • Part Category Diode
  • Package Category Diodes, Axial Diameter Horizontal Mounting
  • Footprint Name Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD CASE 017AG ISSUE O-1
  • Released Date Jan 8, 2026
  • Last Modified Date Jan 8, 2026 10:32 AM UTC
  • Pinout / Pin List Click Here (Member Only)

FDH333TR Details

  • Manufacturer Part Number:

    FDH333TR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead

  • Manufacturer Package Code:

    017AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.78

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    150 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JEDEC-95 Code:

    DO-35

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    125 V

  • Reverse Current-Max:

    0.003 µA

  • Reverse Test Voltage:

    125 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

FDH333TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (Tj) and ensure it stays within the recommended operating range.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Use a low-ESR output capacitor, minimize the PCB's parasitic inductance, and optimize the device's layout for minimal loop inductance. Ensure the device is properly bypassed and decoupled.
  • Follow the onsemi recommended soldering profile, and ensure the device is handled and stored in an ESD-safe environment. Use a soldering iron with a temperature range of 250°C to 260°C, and avoid applying excessive force or pressure during assembly.

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FDH333TR Overview

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