A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
The FDH400TR can withstand voltage stress up to 1.5 times the maximum rated voltage (400V) for a short duration (less than 1 second). However, it's recommended to operate the device within the specified voltage range to ensure reliability.
Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) to protect the device from voltage spikes and surges. Also, ensure that the device is operated within the recommended voltage range and follow proper PCB layout guidelines.
Store the devices in their original packaging or in a dry, cool place. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body, not the leads, to prevent damage.
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FDH400TR Overview
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