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FDMA037N08LC - onsemi

Description: Max rDS(on) = 36.5 mΩ at VGS = 10 V, ID = 4 A ; Max rDS(on) = 56.9 mΩ at VGS = 4.5 V, ID = 3 A ; Low Profile - 0.8 mm maximum in the new package MicroFET 2x2 mm ; Free from halogenated compounds and antimony oxides ; RoHS Compliant

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FDMA037N08LC - onsemi PCB footprint - Other - Other - FDMA037N08LC
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FDMA037N08LC Details

  • Manufacturer Part Number:

    FDMA037N08LC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN-6

  • Package Description:

    WDFN-6

  • Manufacturer Package Code:

    511DB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.0365 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8.3 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA037N08LC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDMA037N08LC is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Typically, this involves connecting the gate to a voltage source through a resistor, and ensuring the drain-source voltage is within the recommended range. Additionally, consider using a gate driver or voltage regulator to provide a stable voltage supply.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conductivity, such as using a thermal pad or heat sink. Ensure the device is mounted on a solid copper plane, and use thermal vias to dissipate heat. Additionally, follow the recommended land pattern and soldering guidelines to minimize thermal resistance.
  • To protect the FDMA037N08LC from overvoltage and overcurrent conditions, consider using voltage clamping devices, such as TVS diodes or zener diodes, to limit the voltage across the device. Additionally, use current limiting resistors or fuses to prevent excessive current from flowing through the device. Implementing overvoltage and overcurrent protection circuits can help prevent damage to the device and ensure reliable operation.
  • To prevent electrostatic discharge (ESD) damage, handle the FDMA037N08LC with care, and follow proper ESD protection measures. Use ESD-safe packaging, wrist straps, and mats, and ensure the device is properly grounded during handling and assembly. Implementing ESD protection circuits, such as ESD diodes or resistors, can also help prevent damage from ESD events.

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