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FDMA908PZ - onsemi

Description: Max rDS(on) = 12.5 mΩ at VGS = -4.5 V, ID = -12 A ; Low Profile - 0.8 mm maximum in the new package MicroFET 2x2 mm ; Max rDS(on) = 28 mΩ at VGS = -1.8 V, ID = -8 A ; Free from halogenated compounds and antimony oxides ; RoHS Compliant ; Max rDS(on) = 18 mΩ at VGS = -2.5 V, ID = -10 A ; HBM ESD protection level > 2.8 kV typical (Note 3)

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PCB Footprints
FDMA908PZ - onsemi PCB footprint - Other - Other - DFN6 2x2, 0.65P CASE 506DT ISSUE O
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3D Models
FDMA908PZ - onsemi  - 3D model - Other - DFN6 2x2, 0.65P CASE 506DT ISSUE O
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FDMA908PZ Details

  • Manufacturer Part Number:

    FDMA908PZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN-6

  • Package Description:

    2 X 2 MM, 0.80 MM HEIGHT, ANTIMONY AND HALOGEN FREE, ROHS COMPLIANT, MICROFET-6

  • Manufacturer Package Code:

    506DT

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.0125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    903 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    344 ns

  • Turn-on Time-Max (ton):

    44 ns

FDMA908PZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the FDMA908PZ, the SOA is limited by the maximum voltage rating of 60V, maximum current rating of 10A, and maximum power rating of 50W.
  • Use ESD-sensitive handling procedures, such as grounding wrist straps and using ESD-protective packaging. Also, ensure that the device is properly connected to a ground plane during PCB assembly.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 300°C (572°F) during soldering.

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FDMA908PZ Overview

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