Description:Max rDS(on) = 5.3 mΩ at VGS = 10 V, ID = 17.5 A; Termination is Lead-free and RoHS Compliant; High performance technology for extremely low rDS(on); Max rDS(on) = 6.8 mΩ at VGS = 4.5 V, ID= 15.0 A
A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep high-current paths short. A heat sink or thermal pad is recommended to dissipate heat. Consult onsemi's application notes and layout guidelines for more information.
The input capacitor values depend on the input voltage, current, and frequency. A general guideline is to use a minimum of 10uF ceramic capacitor with low ESR (Equivalent Series Resistance) and a voltage rating of at least 2x the input voltage. Consult onsemi's application notes and capacitor selection guides for more information.
The maximum allowed voltage drop across the internal FETs is typically around 1.5V to 2V. Exceeding this voltage drop may lead to reduced efficiency, increased heat generation, and potentially damage the device. Consult onsemi's application notes and datasheet for more information.
The OCP threshold is typically set by an external resistor (R_OCP) connected to the OCP pin. Ensure the resistor value is correctly calculated based on the desired OCP threshold and the device's internal OCP circuitry. Consult onsemi's application notes and datasheet for more information.
A recommended startup sequence is to first apply the input voltage, then the enable signal (EN), and finally the clock signal (CLK). This sequence helps prevent damage or malfunction due to incorrect startup conditions. Consult onsemi's application notes and datasheet for more information.
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FDMC7678-L701 Overview
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