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FDMC8010DC - onsemi

Description: Dual Cool™ Top Side Cooling PQFN package; Max rDS(on) = 1.28 mΩ at VGS = 10 V, ID = 37 A; Max rDS(on) = 1.74 mΩ at VGS = 4.5 V, ID = 32 A; High Performance Technology for Extremely Low rDS(on); RoHS Compliant

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PCB Footprints
FDMC8010DC - onsemi PCB footprint - Other - Other - PQFN8 3.3X3.3, 0.65P CASE 483AY ISSUE A
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3D Models
FDMC8010DC - onsemi  - 3D model - Other - PQFN8 3.3X3.3, 0.65P CASE 483AY ISSUE A
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FDMC8010DC Details

  • Manufacturer Part Number:

    FDMC8010DC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Manufacturer Package Code:

    483AY

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2017-02-03

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    337 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    157 A

  • Drain-source On Resistance-Max:

    0.00128 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    205 pF

  • JEDEC-95 Code:

    MO-240BA

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    788 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    74 ns

  • Turn-on Time-Max (ton):

    40 ns

FDMC8010DC Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V) and the output voltage is set to the desired level (e.g., 1.8V or 3.3V). Verify the bias resistors are correctly sized and placed.
  • The maximum output current is 1A, but it's recommended to derate the output current to 0.8A for optimal reliability and thermal performance.
  • The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. To recover, power cycle the device or reduce the output current to prevent overheating.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. Place the capacitor as close to the VIN pin as possible.

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FDMC8010DC Overview

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