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FDMC86259P - onsemi

Description: Very low RDS-on mid voltage P channel silicon technology optimised for low Qg; RoHS Compliant; 100% UIL Tested; Max rDS(on) = 137 mΩ at VGS = -6 V ID = -2.7 A; This product is optimised for fast switching applications as well as load switch applications; Max rDS(on) = 107 mΩ at VGS = -10 V, ID = -3 A

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PCB Footprints
FDMC86259P - onsemi PCB footprint - Other - Other - PQFN8 3.3X3.3, 0.65P CASE 483AW ISSUE O-1
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3D Models
FDMC86259P - onsemi  - 3D model - Other - PQFN8 3.3X3.3, 0.65P CASE 483AW ISSUE O-1
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FDMC86259P Details

  • Manufacturer Part Number:

    FDMC86259P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 33, 8 PIN

  • Manufacturer Package Code:

    483AW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    181 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    3.2 A

  • Drain-source On Resistance-Max:

    0.107 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240BA

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    62 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC86259P Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, the FDMC86259P is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Check the power supply voltage, ensure proper pin connections, and verify that the device is not overheating. Also, review the application circuit and layout to ensure they meet the recommended design guidelines.

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FDMC86259P Overview

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