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FDMC86261P - onsemi

Description: 100% UIL Tested; RoHS Compliant; Max rDS(on) = 185 mΩ at VGS = -6 V, ID = -2.2 A; Very low RDS(on) mid voltage P channel silicon technology optimised for low Qg; This product is optimised for fast switching applications as well as load switch applications; Max rDS(on) = 160 mΩ at VGS = -10 V, ID = -2.4 A

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PCB Footprints
FDMC86261P - onsemi PCB footprint - Other - Other - MLP 3.3x3.3_2022
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3D Models
FDMC86261P - onsemi  - 3D model - Other - MLP 3.3x3.3_2022
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FDMC86261P Details

  • Manufacturer Part Number:

    FDMC86261P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3.30 X 3.30 MM, ROHS COMPLIANT, POWER 33, MLP, 8 PIN

  • Manufacturer Package Code:

    511DH

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.97

  • Avalanche Energy Rating (Eas):

    121 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC86261P Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, the FDMC86261P is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Check the power supply voltage, ensure proper pin connections, and verify that the enable pin is properly biased. Also, check for any signs of physical damage or overheating.

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FDMC86261P Overview

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