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FDMQ8203 - onsemi

Description: Dual N-Channel and Dual P-Channel PowerTrench® MOSFET, GreenBridge™ Series of High-Efficiency Bridge Rectifiers

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PCB Footprints
FDMQ8203 - onsemi PCB footprint - Other - Other - MLP 4.5 x 5
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3D Models
FDMQ8203 - onsemi  - 3D model - Other - MLP 4.5 x 5
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FDMQ8203 Details

  • Manufacturer Part Number:

    FDMQ8203

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-12

  • Package Description:

    5 X 4.50 MM, ROHS COMPLIANT, MLP, 12 PIN

  • Manufacturer Package Code:

    511CS

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Case Connection:

    DRAIN

  • Configuration:

    2 BANKS, COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    3.4 A

  • Drain-source On Resistance-Max:

    0.11 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    37 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMQ8203 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Use a heat sink, ensure good airflow, and follow the recommended thermal design guidelines. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum allowed voltage on the gate driver output is 20V, but it's recommended to keep it below 18V to ensure reliable operation.
  • The FDMQ8203 is designed to operate with a 12V or 15V supply, but it can be used with other voltages (e.g., 9V or 24V) with proper design considerations and component selection.
  • Use a fuse or a current-limiting resistor in series with the device, and consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits.

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FDMQ8203 Overview

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