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FDMS10C4D2N - onsemi

Description: 100% UIL tested ; 50% lower Qrr than other MOSFET suppliers ; RoHS Compliant ; Max rDS(on) = 14 mΩ at VGS = 6 V, ID = 22 A ; Max rDS(on) = 4.2 mΩ at VGS = 10 V, ID = 44 A ; Lowers switching noise/EMI ; ADD ; MSL1 robust package design ; Shielded Gate MOSFET Technology

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FDMS10C4D2N - onsemi PCB footprint - Other - Other - FDMS10C4D2N-1
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FDMS10C4D2N - onsemi  - 3D model - Other - FDMS10C4D2N-1
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FDMS10C4D2N Details

  • Manufacturer Part Number:

    FDMS10C4D2N

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    QFN-8

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2016-09-09

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    337 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    124 A

  • Drain-source On Resistance-Max:

    0.0042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    510 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    52 ns

  • Turn-on Time-Max (ton):

    49 ns

FDMS10C4D2N Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good thermal conduction.
  • The device requires a stable input voltage (VIN) and a proper biasing of the gate-source voltage (VGS) to ensure optimal performance. A voltage regulator and a voltage divider circuit can be used to achieve this.
  • The device is sensitive to electrostatic discharge (ESD) and can be damaged by excessive voltage or current. Handle the device with an anti-static wrist strap or mat, and avoid touching the pins or leads.
  • The gate resistor value depends on the specific application and the required switching frequency. A general guideline is to use a value between 10 ohms and 100 ohms. Consult the application note or a similar design for guidance.
  • For high-power applications, ensure good thermal conduction by using a heat sink, thermal interface material, and a solid ground plane on the PCB. Also, consider the device's thermal resistance (RθJA) and the maximum junction temperature (Tj) when designing the thermal management system.

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