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FDMS5672 - onsemi

Description: Max rDS(on) = 16.5mΩ at VGS = 6V, ID = 8A ; Low Miller Charge ; Max rDS(on) = 11.5mΩ at VGS = 10V, ID = 10.6A ; RoHS Compliant ; Optimized efficiency at high frequencies ; Typ Qg = 32nC at VGS = 10 V

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PCB Footprints
FDMS5672 - onsemi PCB footprint - Other - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O
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3D Models
FDMS5672 - onsemi  - 3D model - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O
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FDMS5672 Details

  • Manufacturer Part Number:

    FDMS5672

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    ROHS COMPLIANT, 8 PIN

  • Manufacturer Package Code:

    506DP

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    10.6 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

FDMS5672 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures (above 125°C).
  • The maximum allowed voltage on the enable pin (EN) is 6V, exceeding this may cause damage to the device.
  • Yes, but ensure the layout is optimized for high-frequency operation, and consider using a snubber circuit to reduce electromagnetic interference (EMI).
  • Use a TVS (transient voltage suppressor) diode or a zener diode to clamp voltage transients, and consider adding a fuse or a PTC (positive temperature coefficient) thermistor for overcurrent protection.

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FDMS5672 Overview

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