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FDMS8050 - onsemi

Description: Ultra Low RDS(on); RoHS Compliant ; Optimized for Low Gate Charge; Advanced Power 5x6mm package; 100% UIL tested

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PCB Footprints
FDMS8050 - onsemi PCB footprint - Other - Other - PQFN8 5X6, 1.27P CASE 483AG ISSUE O_FFW
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3D Models
FDMS8050 - onsemi  - 3D model - Other - PQFN8 5X6, 1.27P CASE 483AG ISSUE O_FFW
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FDMS8050 Details

  • Manufacturer Part Number:

    FDMS8050

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    1536 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    55 A

  • Drain-source On Resistance-Max:

    0.00065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    156 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS8050 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the FDMS8050 is 50 MHz, but it can be overclocked up to 100 MHz with proper thermal management and PCB design.
  • To optimize the layout, keep the FDMS8050 close to the power supply, use a solid ground plane, and minimize the length of the input and output traces. Also, use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The recommended input capacitance for the FDMS8050 is 10 nF to 100 nF, depending on the specific application and operating frequency.
  • To handle thermal management, use a heat sink with a thermal resistance of less than 10°C/W, and ensure good airflow around the device. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum power dissipation of the FDMS8050 is 2.5 W, but it can be derated based on the operating temperature and other factors.

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FDMS8050 Overview

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