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FDMS86252L - onsemi

Description: N-Channel Shielded Gate PowerTrench® MOSFET 150V, 12A, 56mΩ

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FDMS86252L - onsemi PCB footprint - Other - Other - FDMS86252L-4
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FDMS86252L - onsemi  - 3D model - Other - FDMS86252L-4
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FDMS86252L Details

  • Manufacturer Part Number:

    FDMS86252L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    4.4 A

  • Drain-source On Resistance-Max:

    0.056 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS86252L Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDMS86252L is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management.
  • A recommended PCB layout for minimizing EMI includes using a solid ground plane, keeping signal traces short and away from the device, and using shielding or filtering components as needed.
  • Yes, the FDMS86252L is designed to handle high-voltage applications up to 600V, but ensure proper voltage derating and follow the recommended operating conditions.
  • To troubleshoot issues, start by verifying the device's operating conditions, checking for proper voltage and current supply, and reviewing the PCB layout for potential EMI or thermal issues.

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FDMS86252L Overview

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