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FDMS86568-F085 - onsemi

Description: N-Channel PowerTrench® 60V, 80A, 3.5mΩ

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PCB Footprints
FDMS86568-F085 - onsemi PCB footprint - Other - Other - PQFN8 5X6, 1.27P CASE 483BJ ISSUE C
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FDMS86568-F085 - onsemi  - 3D model - Other - PQFN8 5X6, 1.27P CASE 483BJ ISSUE C
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FDMS86568-F085 Details

  • Manufacturer Part Number:

    FDMS86568-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PQFN 5x6 8L (Power 56)

  • Manufacturer Package Code:

    483BJ

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    102 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    36 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    214 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    64 ns

  • Turn-on Time-Max (ton):

    64 ns

FDMS86568-F085 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if possible. The datasheet provides some guidelines, but onsemi also offers a thermal design guide and a layout checklist that can be requested from their support team.
  • The FDMS86568-F085 requires a specific biasing scheme to achieve optimal performance. Onsemi recommends using a resistive divider network to set the bias voltage, and also provides a biasing calculator tool to help with the design. Additionally, the application note AN-1156 provides more detailed information on biasing and compensation.
  • While the datasheet specifies the recommended operating conditions, it's essential to note that the input pins have a maximum allowed voltage of 6V, which is higher than the recommended VCC of 5V. Exceeding this voltage can damage the device.
  • The FDMS86568-F085 has specific power-up and power-down sequencing requirements to prevent damage or incorrect operation. Onsemi recommends following the power-up sequence outlined in the datasheet, and also provides an application note (AN-1157) that covers power-up and power-down considerations.
  • The FDMS86568-F085 is a sensitive device and requires proper ESD protection to prevent damage. Onsemi recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins, and following proper handling and storage procedures to prevent ESD damage.

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FDMS86568-F085 Overview

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