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FDP80N06 - onsemi

Description: Low gate charge ( Typ. 57nC); RDS(on) = 10mΩ ( Max.)@ VGS = 10V, ID = 40A; Low Crss ( Typ. 145pF); Improved dv/dt Capability; Fast Switching Speed; RoHS Compliant

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FDP80N06 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - FDP80N06
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FDP80N06 - onsemi  - 3D model - Transistor Outline, Vertical - FDP80N06
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FDP80N06 Details

  • Manufacturer Part Number:

    FDP80N06

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    480 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    190 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    176 W

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    518 ns

  • Turn-on Time-Max (ton):

    603 ns

FDP80N06 Frequently Asked Questions (FAQs)

  • The maximum SOA for the FDP80N06 is typically defined by the voltage and current ratings, but it's essential to consider the thermal limitations and ensure the device operates within the recommended temperature range to prevent overheating.
  • To minimize switching losses, ensure the gate drive voltage is sufficient (typically 10-15V), and the gate resistance is low (typically <10 ohms). Also, consider using a gate driver IC or a dedicated gate drive circuit to optimize the switching performance.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and ensure the MOSFET is mounted on a heat sink or a thermal pad. Keep the drain and source pins as close as possible to minimize parasitic inductance. Also, consider using thermal vias to improve heat dissipation.
  • Use a voltage clamp or a transient voltage suppressor (TVS) to protect the MOSFET from overvoltage conditions. For overcurrent protection, consider using a current sense resistor and a comparator or an overcurrent protection IC. Also, ensure the PCB layout is designed to minimize parasitic inductance and capacitance.
  • For high-frequency switching applications, ensure the FDP80N06 operates within the recommended voltage and current ratings. Keep the switching frequency below 1 MHz, and ensure the gate drive voltage is sufficient to minimize switching losses. Also, consider using a snubber circuit to reduce electromagnetic interference (EMI).

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FDP80N06 Overview

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