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FDS4672A - onsemi

Description: High power and current handling capability; 11 A, 40 V; RDS(ON) = 13 mΩ @ VGS = 4.5 V; Low gate charge (35 nC typical); High performance trench technology for extremelylow RDS(ON)

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FDS4672A - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8-1
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FDS4672A - onsemi  - 3D model - Small Outline Packages - SOIC-8-1
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FDS4672A Details

  • Manufacturer Part Number:

    FDS4672A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SO-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS4672A Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDS4672A involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To optimize the FDS4672A for low standby power consumption, ensure that the EN pin is properly biased to turn off the device when not in use. Also, minimize the voltage on the VIN pin and use a low-quiescent-current voltage regulator for the VCC pin. Furthermore, consider using a low-power mode or shutdown mode if available.
  • The FDS4672A has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Also, keep the device away from other heat sources and ensure good airflow around the device.
  • To troubleshoot issues with the FDS4672A, start by checking the input voltage, output voltage, and current. Verify that the device is properly biased and that the EN pin is properly driven. Use an oscilloscope to check for switching noise, ringing, or other anomalies. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the FDS4672A is suitable for high-reliability and automotive applications. However, ensure that the device is properly qualified and validated for the specific application. Consult the datasheet and application notes for specific guidelines on using the FDS4672A in these applications.

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FDS4672A Overview

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